New Bond Listing

RMA(Cambodia)Plc.

Issued size:

USD 20 Million

Coupon Rate:

5.50% Annually

Issued date:

09/04/2020

Maturity date:

09/04/2025

Telcotech Ltd.

Issued size:

USD 20 Million

Coupon Rate:

4.50% Annually

Issued date:

25/08/2021

Maturity date:

25/08/2026